William Fornaciari

William Fornaciari is Associate Professor at POLIMI. He published seven books and around 300 papers, collecting 6 best paper awards, one certification of appreciation from IEEE and holds 3 international patents on low power design. Since 1993 he is member of program committees and chair of international conferences in the field of computer architectures, EDA and system-level design. Since 1997 he has been involved in 18 EU- funded international projects and he has been part of the pool of experts of the Call For Tender No. 964-2005 – WING – Watching IST INnovation and knowledge, studying the impact of FP5 and FP6 expenditures to support the identification of FP7 and Horizon2020 research directions. During FP7 he won the 2016 HiPEAC Technology Transfer Award for the output of the CONTREX project, he served as Project Technical Manager of 2PARMA (ranked success story by the EU) and he coordinated the HARPA project where he filed a PCT patent on thermal management. Other contributions were in the projects SMECY and MULTICUBE and CONTREX. In H2020 he coordinates the FET-HPC RECIPE project and also participated to the SafeCOP, M2DC and MANGO projects as principal investigator. He cooperated for 20 years with the Technology Transfer Centre of POLIMI, actively cooperating with companies to the development of leading edge products: industrial exploitation of research ideas is one of his main attitudes.In 2019 his team won the Switch to Product (S2P) competition with a solution on the hardware protection from side-channel attacks. His main research interests cover multi/many core architectures, NoC, low power design, software power estimation, runtime resource management, wireless sensor networks, thermal management, and EDA-based design methodologies tailored to enhance the security of IoT/Embedded systems… He is co-author of the first Italian book on embedded systems and he acted as project reviewer for EC funded projects and invited speaker during EU consultation/information workshops. In 2016 he won the HiPEAC Technology Transfer Award.