Teppo Hemiä is a technology & business executive with 25+ years creating, defining, developing & delivering innovative global technology products & solutions. Experience in international business from start-up founder to creation of half billion business.
Teppo started his career in Nokia 1995, several advanced technology positions in system of chips. Joined STMicroelectronics 2007 to establish Mobile Platform Business Unit. Served the same position throughout acquisition of NXP Wireless and ST-Ericsson joint venture. Teppo is currently CEO, co-founder and partner at Wirepas, since 2014.