[HiPEAC-announce] Cal for Papers: VLSI-SOC 2008
dsoudris
dsoudris at ee.duth.gr
Sat Mar 8 07:24:04 CET 2008
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IFIP/IEEE VLSI-SoC 2008
16th International Conference on Very Large Scale Integration
October 13-15, 2008,
Rhodes Island, Greece
http://vlsi.ee.duth.gr/vlsisoc-2008/
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CALL FOR PAPERS
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IMPORTANT DATES
Paper submission: March 28, 2008
Special Session proposal: March 28, 2008
Notification of acceptance: June 16, 2008
Camera ready submission: July 11, 2008
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ABOUT VLSI-SoC 2008
VLSI-SoC 2008 is the 16th in a series of international conferences sponsored
by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the
state-of-the-art and the new developments in the field of Very Large
Scale Integration Systems and their designs. Previous Conferences have taken
place in Edinburgh, Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado,
Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta.
The purpose of the Conference is to provide a forum to exchange ideas and to
show industrial and research results in the fields of VLSI/ULSI Systems,
VLSI CAD and Microelectronic Design and Test.
Topics of interest include but are not limited to:
* Analog, Digital, and Mixed-Signal IC Design
* 3-D Integration and Physical Design
* Deep Submicron Design and Modeling Issues
* New Devices and MEMS
* Testability and Design for Test
* CAD and Tools
* Digital Signal Processing and Image Processing IC Design
* Prototyping, Validation, and Verification
* Modeling and Simulation
* System-On-Chip Design
* Embedded Systems Design
* New Architectures and Compilers
* Reconfigurable Systems
* Low-Power Design
* Logic and High-Level Synthesis
* New Applications (communications, biosystems, video, automobile,
security, sensor networks, etc.)
* Real-Time Systems
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Keynote Speakers
Prof. Eby Friedman, Univ. of Rochester, USA
Keynote Talk Title: "Interconnect-Based Design Challenges in High
Performance Two- and Three-Dimensional Integrated Circuits and Systems"
Prof. Ahmed Jerraya, CEA/LETI, France
Keynote Talk Title: "Design and Programming strategies for MPSoC"
Dr. Roberto Zafalon, STMicrolectronics, Italy
Keynote Talk Title: "CLEAN: Leakage Aware Design for Next Generation's SOCs"
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Special Sessions
Special Session 1:
Title: "3D integration: how far are we from the next leap forward in system
integration?"
Organizer: Dr. Antonis Papanikolaou, IMEC, Belgium
Special Session 2:
Title: "Subthreshold Architectures and Circuits"
Organizer: Prof. Yusuf Leblebici, EPFL, Switzerland
Special Session 3:
Title: European-funded Research and Development: Present and Future
Organizer: Prof. D. Soudris, Democritus Univ. of Thrace, Greece
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SUBMISSION INSTRUCTIONS
Papers should present original research results not published or submitted
for publication in other forums. Papers should not exceed 6 pages
(single-spaced, 2 columns, 10pt font; see the VLSI-SoC website for detailed
guidelines soon) and must be submitted electronically using the VLSI-SoC
2008 website. The proceedings will be published by IFIP (with ISBN) and
available through IEEE Xplore. They will be distributed during the
conference to all participants. A selection of the conference best papers
will be invited to submit an extended version to be included as chapters of
a book to be published by Springer.
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GENERAL CHAIR
* Prof. Dimitrios Soudris, Democritus Univ. of Thrace, Greece
PROGRAM CO-CHAIRS
* Prof. Christian Piguet, CSEM, Switzerland
* Prof. Thanos Stouraitis, Univ. of Patras, Greece
PUBLICITY CO-CHAIRS
* Prof. David Atienza, Complutense U. of Madrid, Spain
* Prof. Bernard Courtois, TIMA Labs, France
STEERING COMMITTEE:
* Manfred Glesner, TU Darmstadt, DE
* Ricardo Reis, UFRGS, BR
* Michel Robert, U. Montpellier, FR
* Luis Miguel Silveira, INESC ID, PT
* Salvador Mir TIMA LABs, FR
CONFERENCE SECRETARIAT/WEB DESIGN
Christos Baloukas
Democritus Univ. of Thrace
email: vlsisoc2008 at ee.duth.gr
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TECHNICAL PROGRAMME COMMITTEE
Amara Amara, ISEP, France
Ioannis, Andreadis, Democritus Univ. of Thrace, Greece
Federico Angiolini, Bologna University, Italy
Antonios Argyriou, Philips, The Netherlands
Nadine, Azermad, LIRMM, France
Magdy Bayoumi, University of Louisiana at Lafayette, USA
Juergen Becker, Universitaet Karlsruhe, Germany
Cécile Belleudy, Univ. Sophia-Antipolis Nice, France
Mladen Berekovic, Technische Universität Braunschweig, Germany
Swarup Bhunia, Case Western Reserve University, USA
Holger Blume, RWTH-Aachen, Germany
Joao Cardoso, INESC-ID, Portugal
Wim Dehaene, Univ Kath. Leuven, Belgium
Yunsi Fei Univ. of Connecticut, USA
Joan Figueras, Univ. Politecnica de Catalunya, Spain
Dimitris Gizopoulos, University of Piraeus, Greece
Carlo Guardiani, PDF Solutions, Inc., Italy
Frank Kagan Gurkaynak, EPFL, Switzerland
Josef Haid Infineon Technologies, Austria
Alkis Hatzopoulos, Aristotle Univ. of Thessaloniki, Greece
Domenik Helms, OFFIS, Germany
Ahmed Hemani, KTH, Sweden
Tang Hua Univ. of Minnesota, USA
Nathalie Julien, Univ. Bretagne-Sud, France
Srinivas Katkoori, Univ of South Florida, USA
Avinoam Kolodny, Technion-Israel Institute of Technology, Israel
Fadi J. Kurdahi, Univ. California Irvine, USA
Hsien-Hsin S. Lee, Georgia Institute of Technology, USA
Jean-Didier Legat, Univ Louvain-la-Neuve, Belgium
Yung-Hsiang Lu, Univ. of Purdue, USA
Alberto Macii, Politecnico di Torino, Italy
Stylianos Mamagkakis, IMEC, Belgium
Salvador Mir, TIMA Labs, France
Vincent J. Mooney III, Georgia Institute of Technology, USA
Srinivasan Murali, EPFL, Switzerland
Alex Orailoglu, Univ. of San Diego, USA
Vassilis Paliouras, Univ. Patras, Greece
Marios Papaefthymiou, Univ. of Michigan, USA
Antonis Paschalis, Univ. of Athens, Greece
Zebo Peng, Linkoping University, Sweden
Dionisios N. Pnevmatikatos, Technical Univ. of Crete, Greece
Massimo Poncino, Politecnico di Torino, Italy
Ricardo Reis, Universidade Federal do Rio Grande do Sul, Brazil
Marcos Sanchez-Elez, Complutense Univ. of Madrid, Spain
Dimitrios Serpanos, Univ. of Patras, Greece
Cristina Silvano, Politecnico di Milano, Italy
Stylianos Siskos, Aristotle Univ. of Thessalomiki, Greece
Thanos Skodras, Hellenic Open University, Greece
Konstantinos Tatas, Frederick University, Cyprus
Dimitris Velenis, Univ. of Rochester, USA
Miroslav Velev, Univ. Illinois Chicago, USA
Flavio R. Wagner, Universidade Federal do Rio Grande do Sul, Brazil
Shiyan Yu, Michigan Technological Univ., USA
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SPONSORS
VLSI-SoC 2008 is kindly supported and sponsored by the following companies
and
institutions:
+ IFIP WG 10.5
+ IEEE Council on Electronic Design Automation (CEDA)
+ ACM SIGDA
+ Democritus University of Thrace
+ Corallia, Hellenic Technology Clusters Initiative
+ Hellenic Semiconductor Initiative Association
+ Springer
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