[HiPEAC-announce] 6th IEEE Symposium on Application Specific Processors (SASP 2008)

Koen De Bosschere Koen.DeBosschere at elis.ugent.be
Wed Feb 6 22:39:12 CET 2008


Subject: 
CFP: 6th IEEE Symposium on Application Specific Processors (SASP 2008)


===============================================================
                         Call for Papers 

  6th IEEE Symposium on Application Specific Processors (SASP 2008)
                        8-9 June 2008
            Anaheim Convention Center, Anaheim CA USA
                 http://www.sasp-conference.org

                       co-located with the
                Design Automation Conference (DAC)
                          http://www.dac.com

[Please accept our apologies if you get multiple copies of this message]
===============================================================
  DEADLINE FOR ABSTRACT SUBMISSION: March 1st, 2008
  DEADLINE FOR FULL PAPER SUBMISSION: March 5th, 2008
  ACCEPTANCE NOTIFICATION: April 21st, 2008
  FINAL VERSION DUE: Monday, May 8th, 2008

  Submissions will be done online on the SASP web site             
===============================================================

SASP 2008 Areas of Interest
==============================
(more details on the web site)

Dramatic embedded systems volumes and associated market segments force
a reevaluation of the best way to satisfy the possibly conflicting 
demands placed on processor designs. Domain-specific embedded processors, 
such as network, automotive, cellular and others, present interesting 
architectural refinements, albeit at the cost of splintering the embedded 
processor market. Reprogrammable and/or reconfigurable embedded processors 
provide an alternative approach, capable of delivering single, 
fixed-silicon architectures, thus amortizing design and manufacturing 
costs across large volumes, yet necessitating an answer to the challenge 
of effective customization of embedded processors.  

The symposium explores (micro)architectural design approaches and 
trade-offs and compiler technologies, for both domain-specific and 
customizable embedded processors. The symposium aims at generating a 
forum wherein challenges and solutions will be explored, discussed and 
compared. 

Major topics include, but are not limited to:

-   Domain-specific processors (network, multimedia, etc.)
-   Application-specific hardware accelerators
-   Microarchitectural customization techniques
-   (Re)configurable architectures (coarse-grained, FPGA, etc.)
-   Application specific processors in System-on-a-chip (SOC)
-   Application specific customizations for low-power
-   Compiler technology targeting customizable processors
-   Architectural exploration and hardware software codesign
-   Application specific MPSoC
-   Design Automation for NoCs
-   OS and Middleware support for application specific processors


SASP 2008 Paper Submission
============================
The Program Committee invites authors to submit papers up to 
6 pages in length (8 pages possible, additional fee required), 
describing original, unpublished work. 

Clearly describe the nature of the work, explain its significance, 
highlight novel features, and describe its current status.
The paper submission will be considered evidence that, upon acceptance,
the author(s) will present their paper at the symposium. 

Proceedings will appear in the IEEE Digital Library; a special issue in 
a major IEEE journal is also planned for best papers. 


SASP 2008 Contacts
====================

GENERAL CHAIRS
Paolo Ienne, EPFL
Peter Petrov, U Maryland

PROGRAM CHAIRS
Alex Orailoglu, UC San Diego
Laura Pozzi, U Lugano

PUBLICITY CHAIR
Cristina Silvano, Politecnico di Milano

FINANCE CHAIR
Peter Petrov, U Maryland

PROGRAM COMMITTEE Includes:
Elaheh Bozorgzadeh, UC Irvine 
Philip Brisk, EPFL
Ching-Te Chiu, National Tsing Hua U
Nikil Dutt, UC Irvine
Joerg Henkel, U Karlsruhe
Ryan Kastner, UC San Diego
Rainer Leupers, RWTH Aachen U
Grant Martin, Tensilica
Tulika Mitra, National U Singapore
Walid Najjar, UC Riverside
Sri Parameswaran, U New S Wales
JoAnn Paul, Virginia Tech
Norbert Wehn, U Kaiserslautern
Sami Yehia, Thales Group




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