All internship applications for this call
HiPEAC funds several company internships in order to increase industry-academia collaboration. In addition to usual company internship programmes, this mechanism will allow PhDs to directly target company research topics. Even more precisely, each company will list and update every year the research topics for which they are seeking interns. The call will open on March 4th and close on April 11th. The internships are normally expected to take place during the summer, however companies specified they are willing to host interns at other periods of the year, so students should indicate when they would be available for an internship within the next 12 months. Please be aware that only a limited number of positions is available for this call, about the same at each company site.To apply for an internship, click on one of the internships below.
ARM
- SIMD DSP programming
- Asymmetric Multiprocessor Programming/Toolchain
- Fast Simulation of a Processor Core on multiple soft ARM cores on a FPGA
- HW/SW Support of a Soft Floating-point Unit on multiple soft ARM cores on a FPGA
- Modelling and Simulation of Execution-driven ARM core in UNISIM
- Artificial Immunity for Embedded Safety Critical Software
IBM
NXP
STMicroelectronics
- Evaluation of CLI based compilation chain for VLIW processors
- Optimizations in GCC CLI code generator
- Extension of CLI code generator to support a subset of C++
- Exploration of annotation mechanism for the CLI format
- Programming models and tools for highly parallel streaming architectures
- Fractal C components for distributed computing on a computer grid
- Development of an on-chip CLI generation and analysis framework
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