IP Power Signature Detection

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Description

As more and more semiconductor companies outsource die fabrication it will be increasingly valuable to non-destructively identify the presence of specific Intellectual Property (IP) in a third part product.
This work will investigate non-destructive Intellectual Property detection through power-signature or RF-signature analysis. The project will apply the same power-supply and RF analysis techniques that are used in cryptographic key side-channel attacks to detect the presence of IP embedded in third party ICs.

The ideal candidate will have a good background in theoretical and applied signal processing and experience with data acquisition and analysis.